Kusintha ndi kupita patsogolo kwa ukadaulo wa CPO optoelectronic co-packaging Gawo lachiwiri

Kusintha ndi kupita patsogolo kwa CPOzamagetsiukadaulo wopangira zinthu pamodzi

Kuyika zinthu pogwiritsa ntchito optoelectronic si ukadaulo watsopano, chitukuko chake chimayamba m'zaka za m'ma 1960, koma pakadali pano, kuyika zinthu pogwiritsa ntchito photoelectric co-packaging ndi phukusi losavuta lazipangizo zamagetsi za optoelectronicpamodzi. Pofika m'zaka za m'ma 1990, pamenegawo lolumikizirana la kuwalaMu makampani opanga, kujambula zithunzi za magetsi (photoelectric copackaging) kunayamba kuonekera. Chifukwa cha kuchuluka kwa mphamvu zamakompyuta ambiri komanso kufunikira kwa bandwidth yayikulu chaka chino, kujambula zithunzi za magetsi, komanso ukadaulo wake wofanana, kwalandiridwanso chidwi kwambiri.
Pakukula kwa ukadaulo, gawo lililonse lili ndi mitundu yosiyanasiyana, kuyambira pa 2.5D CPO yofanana ndi kufunikira kwa 20/50Tb/s, mpaka 2.5D Chiplet CPO yofanana ndi kufunikira kwa 50/100Tb/s, ndipo pamapeto pake imakwaniritsa 3D CPO yofanana ndi kufunikira kwa 100Tb/s.

2.5D CPO imanyamula zinthugawo la kuwalandi chip ya netiweki yosinthira pa substrate yomweyo kuti ifupikitse mtunda wa mzere ndikuwonjezera kuchuluka kwa I/O, ndipo 3D CPO imalumikiza mwachindunji IC yowunikira ku gawo lapakati kuti ikwaniritse kulumikizana kwa I/O pitch yosakwana 50um. Cholinga cha kusintha kwake n'chomveka bwino, chomwe ndi kuchepetsa mtunda pakati pa gawo losinthira la photoelectric ndi chip yosinthira netiweki momwe zingathere.
Pakadali pano, CPO ikadali yoyambirira, ndipo pakadali mavuto monga kutsika mtengo kwa zokolola komanso ndalama zambiri zokonzera, ndipo opanga ochepa pamsika angapereke zinthu zokhudzana ndi CPO mokwanira. Broadcom, Marvell, Intel, ndi osewera ena ochepa okha ndi omwe ali ndi mayankho enieni pamsika.
Marvell adayambitsa switch yaukadaulo ya 2.5D CPO pogwiritsa ntchito njira ya VIA-LAST chaka chatha. Chip ya silicon optical ikakonzedwa, TSV imakonzedwa ndi mphamvu yokonza ya OSAT, kenako chip yamagetsi imawonjezedwa ku chip ya silicon optical. Ma module 16 a optical ndi chip yosinthira Marvell Teralynx7 amalumikizidwa pa PCB kuti apange switch, yomwe imatha kufikira liwiro losinthira la 12.8Tbps.

Pa OFC ya chaka chino, Broadcom ndi Marvell adawonetsanso mbadwo waposachedwa wa ma switch chips a 51.2Tbps pogwiritsa ntchito ukadaulo wa optoelectronic co-packaging.
Kuchokera ku m'badwo waposachedwa wa tsatanetsatane waukadaulo wa CPO wa Broadcom, phukusi la CPO 3D mpaka kukonza njira kuti pakhale kuchuluka kwa I/O, kugwiritsa ntchito mphamvu kwa CPO mpaka 5.5W/800G, chiŵerengero cha kugwiritsa ntchito mphamvu moyenera ndi chabwino kwambiri magwiridwe antchito ndi abwino kwambiri. Nthawi yomweyo, Broadcom ikudutsanso mpaka mafunde amodzi a 200Gbps ndi 102.4T CPO.
Cisco yawonjezeranso ndalama zake mu ukadaulo wa CPO, ndipo yawonetsa zinthu za CPO mu OFC ya chaka chino, kuwonetsa kusonkhanitsa kwake ukadaulo wa CPO ndikugwiritsa ntchito pa multiplexer/demultiplexer yolumikizidwa bwino. Cisco yati ichita kuyesa kuyika CPO mu ma switch a 51.2Tb, kutsatiridwa ndi kugwiritsa ntchito kwakukulu mu ma switch a 102.4Tb.
Intel yakhala ikuyambitsa ma switch ozikidwa pa CPO kwa nthawi yayitali, ndipo m'zaka zaposachedwa Intel yapitiliza kugwira ntchito ndi Ayar Labs kuti ifufuze njira zothetsera mavuto olumikizana ndi ma bandwidth apamwamba, zomwe zapangitsa kuti pakhale njira yopangira zida zambiri zolumikizirana ndi ma optoelectronic komanso zida zolumikizirana ndi ma optical.
Ngakhale kuti ma module olumikizidwa ndi ma pluggable akadali chisankho choyamba, kusintha kwa mphamvu komwe CPO ingabweretse kwakopa opanga ambiri. Malinga ndi LightCounting, kutumiza kwa CPO kudzayamba kukwera kwambiri kuyambira ma 800G ndi ma 1.6T ports, pang'onopang'ono kuyamba kupezeka pamsika kuyambira 2024 mpaka 2025, ndikupanga kuchuluka kwakukulu kuyambira 2026 mpaka 2027. Nthawi yomweyo, CIR ikuyembekeza kuti ndalama zomwe msika udzapeza kuchokera ku photoelectric package zonse zidzafika $5.4 biliyoni mu 2027.

Kumayambiriro kwa chaka chino, TSMC idalengeza kuti igwirizana ndi Broadcom, Nvidia ndi makasitomala ena akuluakulu kuti apange limodzi ukadaulo wa silicon photonics, CPO ndi zinthu zina zatsopano, ukadaulo wa processing kuyambira 45nm mpaka 7nm, ndipo idati theka lachiwiri lachangu kwambiri la chaka chamawa layamba kukwaniritsa dongosolo lalikulu, pafupifupi 2025 kuti lifike pagawo la voliyumu.
Monga gawo la ukadaulo wophatikizana wokhudza zida zojambulira zithunzi, ma circuits ophatikizika, ma paketi, ma modeling ndi ma simulation, ukadaulo wa CPO umawonetsa kusintha komwe kumabwera chifukwa cha kusakanikirana kwa optoelectronic, ndipo kusintha komwe kumabwera chifukwa cha kutumiza deta mosakayikira ndi kosokoneza. Ngakhale kuti kugwiritsa ntchito CPO kungawonekere m'malo akuluakulu a data kwa nthawi yayitali, ndi kukulirakulira kwa mphamvu yayikulu yamakompyuta ndi zofunikira zambiri za bandwidth, ukadaulo wa CPO photoelectric co-seal wakhala malo atsopano omenyera nkhondo.
Zikuoneka kuti opanga omwe amagwira ntchito mu CPO nthawi zambiri amakhulupirira kuti 2025 idzakhala node yofunika kwambiri, yomwenso ndi node yokhala ndi chiwongola dzanja cha 102.4Tbps, ndipo kuipa kwa ma module olumikizidwa kudzakulitsidwa kwambiri. Ngakhale kuti mapulogalamu a CPO angabwere pang'onopang'ono, kuphatikizana kwa opto-electronic mosakayikira ndiyo njira yokhayo yopezera maukonde othamanga kwambiri, bandwidth yayikulu komanso mphamvu zochepa.