Chisinthiko ndi kupita patsogolo kwaukadaulo wa CPO optoelectronic co-packaging Gawo lachiwiri

Evolution ndi kupita patsogolo kwa CPOoptoelectronicco-packaging teknoloji

Optoelectronic co-packaging siukadaulo watsopano, chitukuko chake chitha kuyambika m'zaka za m'ma 1960, koma pakadali pano, kuphatikiza ma photoelectric ndi phukusi losavuta chabe.zida za optoelectronicpamodzi. Kumayambiriro kwa zaka za m'ma 1990, kuwonjezeka kwaOptical Communication modulemakampani, photoelectric copackaging anayamba kuonekera. Ndi kuphulika kwa mphamvu ya makompyuta ndi kufunikira kwakukulu kwa bandwidth chaka chino, photoelectric co-packaging, ndi teknoloji yokhudzana ndi nthambi yake, yalandiranso chidwi chochuluka.
Pakukula kwaukadaulo, gawo lililonse lilinso ndi mitundu yosiyana, kuchokera ku 2.5D CPO yolingana ndi 20/50Tb/s kufuna, mpaka 2.5D Chiplet CPO yolingana ndi 50/100Tb/s kufuna, ndipo pomaliza kuzindikira 3D CPO yogwirizana ndi 100Tb/s. mlingo.

The 2.5D CPO phukusi laOptical modulendi maukonde lophimba Chip pa gawo lapansi yemweyo kufupikitsa mzere mtunda ndi kuonjezera I/O kachulukidwe, ndi 3D CPO mwachindunji zikugwirizana kuwala IC kwa wosanjikiza mkhalapakati kukwaniritsa interconnection wa I/O phula zosakwana 50um. Cholinga cha chisinthiko chake ndi chomveka bwino, chomwe ndi kuchepetsa mtunda pakati pa photoelectric conversion module ndi network switching chip momwe mungathere.
Pakalipano, CPO idakali yakhanda, ndipo pali mavuto monga zokolola zochepa komanso mtengo wokonzekera, ndipo opanga ochepa pamsika angapereke mokwanira zinthu zokhudzana ndi CPO. Broadcom, Marvell, Intel, ndi osewera ena ochepa okha ndi omwe ali ndi mayankho pamsika.
Marvell adayambitsa kusintha kwaukadaulo wa 2.5D CPO pogwiritsa ntchito njira ya VIA-LAST chaka chatha. Pambuyo pokonza silicon optical chip, TSV imakonzedwa ndi mphamvu ya OSAT, ndiyeno chipangizo chamagetsi chamagetsi chimawonjezeredwa ku silicon optical chip. Ma module 16 owoneka bwino ndi chip chosinthira Marvell Teralynx7 amalumikizidwa pa PCB kuti apange chosinthira, chomwe chimatha kukwaniritsa kusintha kwa 12.8Tbps.

Pa OFC ya chaka chino, Broadcom ndi Marvell adawonetsanso tchipisi taposachedwa ta 51.2Tbps pogwiritsa ntchito ukadaulo wa optoelectronic co-packaging.
Kuchokera m'badwo waposachedwa wa Broadcom wa CPO zaukadaulo, phukusi la CPO 3D kudzera pakuwongolera njira kuti mukwaniritse kuchuluka kwa I / O, kugwiritsa ntchito mphamvu kwa CPO mpaka 5.5W / 800G, chiŵerengero champhamvu champhamvu ndi ntchito yabwino kwambiri ndi yabwino kwambiri. Panthawi imodzimodziyo, Broadcom ikudutsanso kumtunda umodzi wa 200Gbps ndi 102.4T CPO.
Cisco yawonjezeranso ndalama zake muukadaulo wa CPO, ndipo idapanga chiwonetsero chazinthu za CPO mu OFC ya chaka chino, kuwonetsa luso lake laukadaulo la CPO ndikugwiritsira ntchito pa multiplexer/demultiplexer. Cisco yati iyendetsa kuyendetsa ndege kwa CPO mu masiwichi a 51.2Tb, kutsatiridwa ndi kukhazikitsidwa kwakukulu mumayendedwe osinthira a 102.4Tb.
Intel yakhala ikuyambitsa zosintha za CPO, ndipo m'zaka zaposachedwa Intel yakhala ikugwira ntchito ndi Ayar Labs kuti ifufuze njira zolumikizirana ndi ma bandwidth apamwamba, ndikutsegulira njira yopangira makina ophatikizira optoelectronic ndi zida zolumikizirana.
Ngakhale ma plugable ma module akadali chisankho choyamba, kuwongolera kwamphamvu kwamphamvu komwe CPO ingabweretse kwakopa opanga ambiri. Malinga ndi LightCounting, kutumiza kwa CPO kudzayamba kuwonjezeka kwambiri kuchokera ku 800G ndi madoko a 1.6T, pang'onopang'ono kumayamba kugulitsidwa kuchokera ku 2024 mpaka 2025, ndikupanga voliyumu yayikulu kuchokera ku 2026 mpaka 2027. Panthawi imodzimodziyo, CIR ikuyembekeza kuti ndalama zamsika zonyamula zithunzi zazithunzi zidzafika $ 5.4 biliyoni mu 2027.

Kumayambiriro kwa chaka chino, TSMC adalengeza kuti igwirizana ndi Broadcom, Nvidia ndi makasitomala ena akuluakulu kuti apange luso lamakono la silicon photonics, ma CD owoneka bwino a CPO ndi zinthu zina zatsopano, njira zamakono kuchokera ku 45nm mpaka 7nm, ndipo adanena kuti theka lachiwiri lachangu kwambiri. wa chaka chamawa anayamba kukumana ndi dongosolo lalikulu, 2025 kapena kuposa kufika siteji voliyumu.
Monga gawo laukadaulo lamitundu yosiyanasiyana yokhudzana ndi zida za Photonic, mabwalo ophatikizika, kuyika, kutengera ndi kuyerekezera, ukadaulo wa CPO ukuwonetsa kusintha komwe kumabwera chifukwa cha kuphatikizika kwa optoelectronic, ndipo zosintha zomwe zimabweretsedwa pakufalitsa deta mosakayikira ndizosokoneza. Ngakhale kugwiritsa ntchito CPO kungawonekere m'malo akuluakulu a deta kwa nthawi yaitali, ndi kuwonjezereka kwina kwa mphamvu zazikulu zamakompyuta ndi zofunikira zazikulu za bandwidth, teknoloji ya CPO photoelectric co-chisindikizo yakhala malo atsopano omenyera nkhondo.
Zitha kuwoneka kuti opanga omwe amagwira ntchito ku CPO amakhulupirira kuti 2025 idzakhala mfundo yofunika kwambiri, yomwe ilinso node yokhala ndi kusinthana kwa 102.4Tbps, ndipo kuipa kwa ma modules pluggable kudzakulitsidwanso. Ngakhale kuti mapulogalamu a CPO angabwere pang'onopang'ono, opto-electronic co-packaging mosakayikira ndiyo njira yokhayo yopezera liwiro lapamwamba, bandwidth yapamwamba ndi maukonde otsika mphamvu.