Kusankha Gwero Labwino la Laser: Edge Emission Semiconductor Laser Gawo Lachiwiri

Kusankha Kwabwino KwambiriGwero la Laser: Kutuluka kwa MphepeteLaser Yopangira Zinthu ZazikuluGawo Lachiwiri

4. Momwe mungagwiritsire ntchito ma lasers a semiconductor a m'mphepete
Chifukwa cha kutalika kwa mafunde ake komanso mphamvu zake zambiri, ma laser a semiconductor otulutsa m'mphepete agwiritsidwa ntchito bwino m'magawo ambiri monga magalimoto, kulumikizana kwa kuwala, ndilaserchithandizo chamankhwala. Malinga ndi Yole Developpement, bungwe lodziwika bwino padziko lonse lapansi lofufuza za msika, msika wa laser wotuluka m'mphepete udzakula kufika pa $7.4 biliyoni mu 2027, ndi kuchuluka kwa pachaka kwa 13%. Kukula kumeneku kudzapitilira kuyendetsedwa ndi kulumikizana kwa kuwala, monga ma module a kuwala, ma amplifiers, ndi mapulogalamu owonera a 3D pakulankhulana kwa deta ndi kulumikizana. Pazofunikira zosiyanasiyana za ntchito, njira zosiyanasiyana zopangira kapangidwe ka EEL zapangidwa mumakampaniwa, kuphatikiza: ma laser a Fabripero (FP) semiconductor, ma laser a Distributed Bragg Reflector (DBR) semiconductor, ma laser a external cavity laser (ECL) semiconductor, ma laser a distribution feedback semiconductor (Laza ya DFB), ma laser a quantum cascade semiconductor (QCL), ndi ma laser diode a dera lalikulu (BALD).

Chifukwa cha kufunikira kwakukulu kwa kulumikizana kwa kuwala, kugwiritsa ntchito 3D sensing applications ndi madera ena, kufunikira kwa ma semiconductor lasers kukukulirakuliranso. Kuphatikiza apo, ma semiconductor lasers otulutsa m'mphepete ndi ma semiconductor lasers otulutsa pamwamba omwe ali ndi vertical-cavity nawonso amachita gawo lodzaza zofooka za wina ndi mnzake m'mapulogalamu atsopano, monga:
(1) Pankhani yolumikizirana ndi kuwala, ma 1550 nm InGaAsP/InP Distributed Feedback ((DFB laser) EEL ndi 1300 nm InGaAsP/InGaP Fabry Pero EEL amagwiritsidwa ntchito kwambiri pa mtunda wa ma transmission wa 2 km mpaka 40 km ndipo ma transmission amafika pa 40 Gbps. Komabe, pa mtunda wa ma transmission wa 60 m mpaka 300 m komanso liwiro lotsika la ma transmission, ma VCsel otengera ma 850 nm InGaAs ndi AlGaAs ndi omwe amalamulira.
(2) Ma laser otulutsa pamwamba pa nthaka omwe ali ndi vertical cavity ali ndi ubwino wa kukula kochepa komanso kutalika kwa mtunda wopapatiza, kotero akhala akugwiritsidwa ntchito kwambiri pamsika wamagetsi, ndipo ubwino wa kuwala ndi mphamvu wa ma laser otulutsa m'mphepete mwa semiconductor umatsegula njira yogwiritsira ntchito ma remote sensitivity komanso processing yamphamvu kwambiri.
(3) Ma laser onse a semiconductor otulutsa m'mphepete ndi ma vertical cavity surface-emitting semiconductor lasers angagwiritsidwe ntchito pa liDAR yaifupi komanso yapakatikati kuti akwaniritse ntchito zinazake monga kuzindikira malo osawona ndi kuchoka panjira.

5. Chitukuko chamtsogolo
Laser ya semiconductor yotulutsa m'mphepete ili ndi ubwino wodalirika kwambiri, miniaturization komanso mphamvu yowala kwambiri, ndipo ili ndi mwayi wogwiritsidwa ntchito kwambiri mu kulumikizana kwa kuwala, liDAR, zamankhwala ndi zina. Komabe, ngakhale njira yopangira ma laser a semiconductor otulutsa m'mphepete yakhala yokhwima, kuti ikwaniritse kufunikira kwakukulu kwa misika yamafakitale ndi ogula a ma laser a semiconductor otulutsa m'mphepete, ndikofunikira kupitiliza kukonza ukadaulo, njira, magwiridwe antchito ndi zina mwazinthu za ma laser a semiconductor otulutsa m'mphepete, kuphatikiza: kuchepetsa kuchuluka kwa zolakwika mkati mwa wafer; Kuchepetsa njira zoyendetsera; Kupanga ukadaulo watsopano kuti ulowe m'malo mwa njira zachikhalidwe zopukutira gudumu ndi blade wafer zomwe zimayambitsa zolakwika; Konzani kapangidwe ka epitaxial kuti muwongolere magwiridwe antchito a laser yotulutsa m'mphepete; Kuchepetsa ndalama zopangira, ndi zina zotero. Kuphatikiza apo, chifukwa kuwala kotulutsa kwa laser yotulutsa m'mphepete kuli m'mphepete mwa semiconductor laser chip, zimakhala zovuta kupeza ma chip ang'onoang'ono, kotero njira yolumikizirana nayo ikufunikabe kupititsidwa patsogolo.